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Printed Circuit Board, also known as PCB for short, is an important part of electronic products. Due to the repeatability (reproducibility) and consistency of the printed circuit board graphics, it reduces the wiring and assembly errors save the maintenance, debugging and inspection time of the equipment. The design can be standardized to facilitate interchange; printed circuit board wiring high density, small size, light weight, which is conducive to the miniaturization of electronic equipment; is conducive to mechanization and automated production, and improves labor Yield and reduce the cost of electronic equipment.
In recent years, circuit boards have developed towards light, thin, small and high-density interconnection trends. More micro-devices, which promote the design of printed circuit boards to develop in terms of high density, high precision, multilayer and small drills. In order to meet the requirements of the development of refined electronic products, electronic products are also constantly developing in the direction of thinner. This also brings new challenges to the manufacturing process of printed circuit boards. For the preparation of ultra-thin printed circuit boards, new processes and new equipment must be developed to avoid the equipment's limitation of board thickness during the production process or to avoid problems such as deformation and warpage of the production board.
Ultra-thin FR4 PCBs means much thinner than normal FR4 PCBs, normal PCB thickness is around 0.8~2.0mm, while extremely thin PCB is usually 0.25mm, 0.2mm or even 0.15mm, due to the limit to space or margin or engineering design purpose, used in the application of SIM card, sensor design which makes the devices more portable, lighter and more flexible like a flexible Printed Circuits Board, but more rigid than flexible PCBs. Union Circuits has a strong research team focus on Ultra-thin FR4 PCBs manufacturing for years, we have a lot of experience on this field, we also make Flexible PCBs with Polyimide(PI) material, if you need a thickness lower than 0.15mm, we would suggest to use FPC instead, as the standard thickness for single-sided FPC can be 0.07mm, and 0.1 mm for double-sided flexible circuits. Base on the application, you can chose the right material to use.
Application of Ultra-thin FR4 PCBs
● SIM Card, TF Card
● Metro coins
● Wearable devices
● Mobile Phone
● NFC devices
Ultra-thin PCB Capability
Layer Count |
1~4 |
Material |
FR4(Tg130), FR4(Tg150), FR4(Tg170), FR4(Tg180) |
Finished Thickness |
0.1~0.4mm |
Finished Outer Cu Thickness |
HOZ, 1OZ, 2OZ, 3OZ |
Finished Inner Cu Thickness |
HOZ, 1OZ, 2OZ, 3OZ |
Surface Finish |
OSP, Immersion Gold/Tin/Silver, Hard Gold Plating |
Soldermask |
Green, White, Black, Blue, Red, Yellow |
Silkscreen |
White, Black, Yellow |
Panel Size |
Minimum 50x50mm, Maximum 500x500mm |
Quality Requirement |
IPC Class 2, IPC Class 3 |
Business Terms
MOQ |
NO, from single piece to max |
Production Lead Time |
Quick turn 3~5 Working Days, mass production 5~20 Working Days |
Data Format |
Gerber RS-274-D/X, .pcb, .pcbdoc, .cam, ODB++, .dxf, .dwg... |
E-Test |
100% E-test(cost included in the Unit Price, NO extra charge) |
Certifications |
UL, CUL, ISO9000, ISO14001, IATF16949. |
Standard |
IPC-A-600H Class 2(default), Class 3 (base on request) |
Packing |
Inner vacuum + foam, Outer carton box |
Shipping terms |
DAP by DHL, UPS, TNT or FedEx, DAP/EXW/FCA/FOB HK, By Sea |
Payment |
T/T, PayPal, Western Union (USD, EUR) |
http://www.unitpcba.com/
